US Patent 11463117 Radio frequency module and communication device

A radio frequency module includes: a power amplifier; an inductor connected between the power amplifier and a power-supply terminal to supply a power-supply voltage to the power amplifier; a capacitor connected between a ground and a node that is located between the inductor and the power-supply terminal; a module substrate including a first principal surface and a second principal surface opposite to each other; and a plurality of post electrodes disposed on the second principal surface. Here, the inductor is disposed on the first principal surface or inside of the module substrate, and at least one of the power amplifier or the capacitor is disposed on the second principal surface.