US Patent 11464135 Liquid cooling enclosure for circuit components

A liquid cooling enclosure configured to house and cool at least one circuit component, the liquid cooling enclosure including an inner wall, an outer wall, the outer wall being spaced from the inner wall to form an internal channel, an inlet in fluid communication with the internal channel, the inlet being configured to receive cooling liquid, and an outlet in fluid communication with the internal channel, the outlet being configured to return cooling liquid, wherein the at least one circuit component is positioned within the liquid cooling enclosure and the cooling liquid is circulated around the at least one circuit component via the internal channel.