US Patent 11469485 Embedded microstrip transmission line
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Patent Inventor Names
Isaac Lauer0
Neereja Sundaresan0
Srikanth Srinivasan0
William Francis Landers0
Edits on 12 Oct, 2022
Golden AI
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US Patent 11469485 Embedded microstrip transmission line
Article
Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.
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Patent Jurisdiction
Patent Number
114694850
Date of Patent
October 11, 2022
0Patent Application Number
170761070
Date Filed
October 21, 2020
0Patent Citations
Patent Primary Examiner
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