US Patent 11476219 Metal-bump sidewall protection
Patent 11476219 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Chin-Fu Kao0
Jian-Yang He0
Jung-Hua Chang0
Edits on 25 Apr, 2023
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US Patent 11476219 Metal-bump sidewall protection
Article
A method includes forming a metal bump on a top surface of a first package component, forming a solder region on a top surface of the metal bump, forming a protection layer extending on a sidewall of the metal bump, reflowing the solder region to bond the first package component to a second package component, and dispensing an underfill between the first package component and the second package component. The underfill is in contact with the protection layer.
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
114762190
Date of Patent
October 18, 2022
0Patent Application Number
170269830
Date Filed
September 21, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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