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US Patent 11477913 Integrating thermal storage system in electronics cooling
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Current Assignee
Baidu Usa
Date Filed
January 7, 2021
Date of Patent
October 18, 2022
Patent Applicant
Baidu Usa
Patent Application Number
17143997
Patent Citations
US Patent 11297741 High resilient deployment based cooling system for electronic racks
US Patent 10285310 Computer data center cooling and electricity generation using recovered heat
US Patent 11076505 Cooling system for edge computing device
US Patent 11206745 Highly integrated liquid cooling system design for data center IT room
US Patent 11317543 High power density based two phase system design
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11477913
Patent Primary Examiner
Courtney L Smith
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