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US Patent 11482513 Heterogeneous substrate bonding for photonic integration
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Patent
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Date Filed
June 25, 2019
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Date of Patent
October 25, 2022
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Patent Applicant
Skorpios Technologies
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Patent Application Number
16452212
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Patent Citations
US Patent 10373939 Hybrid integrated optical device
Patent Citations Received
US Patent 12111207 Despeckling in optical measurement systems
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US Patent 12089931 Optical sensor for skin-contact detection and physiological parameter measurement at wearable electronic device
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US Patent 11881678 Photonics assembly with a photonics die stack
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Patent Inventor Names
Stephen B. Krasulick
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John Dallesasse
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11482513
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Patent Primary Examiner
Shouxiang Hu
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CPC Code
H01L 21/2007
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H01L 25/0753
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G02B 6/1225
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G02B 6/136
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G02B 6/12002
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G02B 2006/12147
0
H01L 33/486
0
H01L 33/62
0
H01L 33/44
0
H01L 2924/0002
0
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