Patent 11486661 was granted and assigned to TE Connectivity on November, 2022 by the United States Patent and Trademark Office.
A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. The thermal bridge includes upper spring elements extending from upper plates having upper mating interfaces engaging lower plates to bias the upper plates in a first biasing direction generally away from the lower bridge assembly. The thermal bridge includes lower spring elements extending from lower plates having lower mating interfaces engaging upper plates to bias the lower plates in a second biasing direction generally away from the upper bridge assembly. A bridge frame having connecting elements extends through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.