US Patent 11488796 Thermal break for high-frequency antennae
Patent 11488796 was granted and assigned to Applied Materials on November, 2022 by the United States Patent and Trademark Office.
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Patent Number
114887960
Date of Patent
November 1, 2022
0Patent Application Number
168286020
Date Filed
March 24, 2020
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Patent Primary Examiner
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US Patent 11488796 Thermal break for high-frequency antennae
Article
Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
114887960
Date of Patent
November 1, 2022
0Patent Application Number
168286020
Date Filed
March 24, 2020
0Patent Citations
Patent Primary Examiner
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