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US Patent 11494682 Quantum computing assemblies

Patent 11494682 was granted and assigned to Intel on November, 2022 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Intel
Intel
Current Assignee
Intel
Intel
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11494682
Date of Patent
November 8, 2022
Patent Application Number
16766411
Date Filed
December 29, 2017
Patent Citations
‌
US Patent 10068181 Microwave integrated quantum circuits with cap wafer and methods for making the same
‌
US Patent 10380496 Quantum computing assemblies
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US Patent 10826492 Power gating in stacked die structures
Patent Citations Received
‌
US Patent 11961743 Substrate manufacturing method for realizing three-dimensional packaging
0
Patent Primary Examiner
‌
Brook Kebede
CPC Code
‌
H01L 39/2474
‌
G06N 10/00
‌
H01L 27/18
‌
G06N 10/40
‌
H01L 21/4857
‌
G06N 10/20
‌
H01L 39/025

Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.

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