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US Patent 11495538 Fully aligned via for interconnect
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Patent
Date Filed
July 18, 2020
Date of Patent
November 8, 2022
Patent Application Number
16932731
Patent Citations
US Patent 10177028 Method for manufacturing fully aligned via structures having relaxed gapfills
US Patent 10395986 Fully aligned via employing selective metal deposition
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11495538
Patent Primary Examiner
Tu-Tu V Ho
CPC Code
H01L 23/5226
H01L 23/53257
H01L 21/76897
H01L 23/53242
H01L 23/5283
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