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US Patent 11495560 Chiplets with connection posts
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Is a
Patent
Date Filed
January 31, 2020
Date of Patent
November 8, 2022
Patent Application Number
16778964
Patent Citations
US Patent 10750614 Deformable electrical contacts with conformable target pads
US Patent 10777521 Printable component structure with electrical contact
US Patent 11064609 Printable 3D electronic structure
US Patent 10796971 Pressure-activated electrical interconnection with additive repair
US Patent 10222698 Chiplets with wicking posts
US Patent 10468363 Chiplets with connection posts
US Patent 10468391 Inorganic light-emitting-diode displays with multi-ILED pixels
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11495560
Patent Primary Examiner
David A Zarneke
CPC Code
H01L 2224/08113
H01L 2224/16113
H01L 2224/32113
H01L 2224/05011
H01L 2224/05557
H01L 2224/05017
H01L 2224/05022
H01L 2224/05026
H01L 2224/05567
H01L 2224/05023
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