US Patent 11495724 Superconducting structure and device surface termination with alloy
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Benjamin Wymore0
Christian Lavoie0
Markus Brink0
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US Patent 11495724 Superconducting structure and device surface termination with alloy
Article
A method of fabricating a superconductor device includes providing a first metal layer on top of the substrate. An oxidation of a top surface of the first metal layer is rejected. A second metal layer is deposited on top of the second metal layer. A superconducting alloy of the first metal layer and the second metal layer is created between the first metal layer and the second metal layer. There is no oxide layer between the superconducting alloy and the first metal layer.
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Patent Jurisdiction
Patent Number
114957240
Date of Patent
November 8, 2022
0Patent Application Number
169350780
Date Filed
July 21, 2020
0Patent Citations
Patent Primary Examiner
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