Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 15, 2022
Patent Application Number
17082643
Date Filed
October 28, 2020
Patent Citations
Patent Primary Examiner
Semiconductor packages described herein include a thermal capacitor designed to absorb transient heat pulses from a power semiconductor die and subsequently release the transient heat pulses to a surrounding environment, and/or a recessed pad feature. Corresponding methods of production are also described.
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