Patent 11504690 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2022 by the United States Patent and Trademark Office.
An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.