US Patent 11505623 Modified butadiene polymer and rubber composition
Patent 11505623 was granted and assigned to The Yokohama Rubber Co., Ltd. on November, 2022 by the United States Patent and Trademark Office.
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Edits on 27 Mar, 2023
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115056230
Date of Patent
November 22, 2022
0Patent Application Number
166117130
Date Filed
May 8, 2018
0Patent Citations
Patent Primary Examiner
CPC Code
Edits on 25 Nov, 2022
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Article (+601 characters)
US Patent 11505623 Modified butadiene polymer and rubber composition
Article
The present invention provides a compounding agent which, when used in a rubber composition containing a reinforcing filler, exhibits excellent dispersibility, workability, toughness, low heat build-up, and wear resistance; and a rubber composition containing the compounding agent. A modified butadiene polymer of the present invention has a functional group containing a nitrogen atom and silicon atom at a terminal, a weight average molecular weight of the modified butadiene polymer being from 1000 to 15000, and a molecular weight distribution of the modified butadiene polymer being 2.0 or less.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115056230
Date of Patent
November 22, 2022
0Patent Application Number
166117130
Date Filed
May 8, 2018
0Patent Citations
Patent Primary Examiner
CPC Code
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