US Patent 11508656 Semiconductor package and method
Patent 11508656 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 28, 2021
Date of Patent
November 22, 2022
Patent Applicant
Patent Application Number
17359892
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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