US Patent 11512193 Polymeric substrate including a barrier layer

A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness of greater than 200 μm to 6,500 μm. A shaped polymeric article comprising the polymeric substrate is also disclosed.