US Patent 11515173 Semiconductor devices and methods of manufacturing
Patent 11515173 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2022 by the United States Patent and Trademark Office.
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US Patent 11515173 Semiconductor devices and methods of manufacturing
Interconnect devices, packaged semiconductor devices and methods are disclosed herein that are directed towards embedding a local silicon interconnect (LSI) device and through substrate vias (TSVs) into system on integrated substrate (SoIS) technology with a compact package structure. The LSI device may be embedded into SoIS technology with through substrate via integration to provide die-to-die FL connection arrangement for super large integrated Fan-Out (InFO) for SBT technology in a SoIS device. Furthermore, the TSV connection layer may be formed using lithographic or photoresist-defined vias to provide eLSI P/G out to a ball-grid-array (BGA) connection interface.
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