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US Patent 11515265 Fan-out semiconductor package

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

July 21, 2020

Date of Patent

November 29, 2022

Patent Application Number

16934889

Patent Citations

US Patent 10867924 Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing

US Patent 10347585 Fan-out semiconductor package

US Patent 10388614 Fan-out semiconductor package and method of manufacturing same

US Patent 10779406 Wiring substrate

US Patent 10037963 Package structure and method of forming the same

US Patent 10043772 Fan-out semiconductor package

US Patent 10062652 Fan-out semiconductor package and method of manufacturing same

US Patent 10068824 Electronic component package having electronic component within a frame on a redistribution layer

US Patent 10098228 Electronic component device and method for manufacturing the same

US Patent 10163860 Semiconductor package structure

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Mohammed Shamsuzzaman

CPC Code

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