Patent 11515356 was granted and assigned to Avicenatech, Corp. on November, 2022 by the United States Patent and Trademark Office.
In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.