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US Patent 11523514 Method for fabrication of a soft-matter printed circuit board

Patent 11523514 was granted and assigned to Carnegie Mellon University on December, 2022 by the United States Patent and Trademark Office.

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A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

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