Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 20, 2022
Patent Application Number
17357542
Date Filed
June 24, 2021
Patent Citations
Patent Primary Examiner
A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.
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