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US Patent 11532816 Ion conductive layer including binder material

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Gaurav Assat0

Yuto Takagi0

Vladimir Ouspenski0

Ruofan Wang0

Michael McGahan0

Chuanping Li0

Date of Patent

December 20, 2022

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Patent Application Number

177345990

Date Filed

May 2, 2022

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Patent Citations

US Patent 10374254 Composite electrolytes

Patent Citations Received

US Patent 11984598 Ion conductive layer and methods of forming

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Patent Primary Examiner

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CPC Code

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An ion conductive layer can include a hygroscopic ion conductive material, such as a halide-based material. In an embodiment, the ion conductive layer can include an organic material, ammonium halide, or a combination thereof.

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