US Patent 11535949 Substrate holder and plating apparatus
Patent 11535949 was granted and assigned to Ebara Corporation on December, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 25, 2019
Date of Patent
December 27, 2022
Patent Applicant
Patent Application Number
16451387
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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