Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 27, 2022
Patent Application Number
16881452
Date Filed
May 22, 2020
Patent Citations
Patent Citations Received
Patent Primary Examiner
Provided is an interposer structure. The interposer structure comprises an interposer substrate, an interlayer insulating film which covers a top surface of the interposer substrate, a capacitor structure in the interlayer insulating film and a wiring structure including a first wiring pattern and a second wiring pattern spaced apart from the first wiring pattern, on the interlayer insulating film, wherein the capacitor structure includes an upper electrode connected to the first wiring pattern, a lower electrode connected to the second wiring pattern, and a capacitor dielectric film between the upper electrode and the lower electrode.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.