US Patent 11542019 Z-CNT filled meltable adhesives for bonding of deicers
Patent 11542019 was granted and assigned to Goodrich Corporation on January, 2023 by the United States Patent and Trademark Office.
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Edits on 25 Oct, 2023
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Patent Inventor Names
Casey Slane0
Jin Hu0
Nathaniel Ching0
Peter J. Walsh0
Edits on 4 Jan, 2023
Golden AI
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US Patent 11542019 Z-CNT filled meltable adhesives for bonding of deicers
Article
A method of making an adhesive for an ice protection assembly includes transferring Z-CNTs from a substrate carrier into the adhesive. De-bonding of the adhesive for ice protection assembly inspection or repair or repositioning at initial installation includes heating the Z-CNTs in the adhesive to soften the adhesive and allow for easy removal.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115420190
Date of Patent
January 3, 2023
0Patent Application Number
165787310
Date Filed
September 23, 2019
0Patent Citations
Patent Primary Examiner
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