Patent attributes
An electronic device module includes: a substrate; a sealing portion disposed on the substrate; at least one electronic device mounted on the substrate and embedded in the sealing portion; and a roof wiring at least partially disposed on a surface of the sealing portion and electrically connecting the substrate to the at least one electronic device or electrically connecting electronic devices, among the at least one electronic device, to each other. The roof wiring includes: a surface wiring disposed on one surface of the sealing portion; and at least one post wiring connecting the surface wiring to the substrate or to the at least one electronic device, and wherein at least a portion of a circumferential surface of the at least one post wiring is bonded to the surface wiring.
