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US Patent 11551993 Power overlay module and method of assembling
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Patent
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Date Filed
August 28, 2020
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Date of Patent
January 10, 2023
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Patent Application Number
17005536
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Patent Citations
US Patent 10269688 Power overlay structure and method of making same
US Patent 10269699 Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics
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US Patent 10186477 Power overlay structure and method of making same
Patent Inventor Names
Christopher James Kapusta
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Weijun Yin
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Richard Anthony Eddins
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Liqiang Yang
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David Richard Esler
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Arun V. Gowda
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11551993
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Patent Primary Examiner
Zachary Pape
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CPC Code
H01L 23/3672
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H01L 23/36
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H01L 23/3731
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H05K 7/20509
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H05K 7/20481
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H05K 7/2039
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H05K 7/209
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H01L 23/467
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