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US Patent 11552041 Chemical mechanical polishing for hybrid bonding

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

November 12, 2020

Date of Patent

January 10, 2023

Patent Application Number

17096846

Patent Citations

US Patent 10147641 3D IC method and device

US Patent 10204893 Stacked dies and methods for forming bonded structures

US Patent 10211166 Semiconductor device and method of manufacturing the same

US Patent 10269708 Increased contact alignment tolerance for direct bonding

US Patent 10269756 Die processing

US Patent 10269778 Package on package (PoP) bonding structures

US Patent 10002844 Bonded structures

US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

US Patent 10312275 Single-photon avalanche diode image sensor with photon counting and time-of-flight detection capabilities

US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices

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Patent Citations Received

US Patent 11804377 Method for preparing a surface for direct-bonding

US Patent 11929347 Mixed exposure for large die

0

US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same

0

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

CPC Code

H01L 2224/05155

H01L 2224/06131

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