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US Patent 11553622 Connector assembly

Patent 11553622 was granted and assigned to Molex on January, 2023 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Molex
Molex
Current Assignee
Molex
Molex
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11553622
Date of Patent
January 10, 2023
Patent Application Number
17069872
Date Filed
October 14, 2020
Patent Citations
‌
US Patent 10446960 Electrical connector assembly equipped with heat pipe and additional heat sink
‌
US Patent 10886661 Connector and radiator
Patent Citations Received
‌
US Patent 11777238 Receptacle assembly, interface card, and electronic device having the same
Patent Primary Examiner
‌
Stephen S Sul
CPC Code
‌
G02B 6/4292
‌
H01R 13/502
‌
G02B 6/4256
‌
H05K 7/20409
‌
H01R 13/6581
‌
G02B 6/4269

The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.

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