US Patent 11557086 Three-dimensional (3D) shape modeling based on two-dimensional (2D) warping

An electronic device and method for 3D modeling based on 2D warping is disclosed. The electronic device acquires a color image of a face of a user, depth information corresponding to the color image, and a point cloud of the face. A 3D mean-shape model of a reference 3D face is acquired, and rigid aligned with the point cloud. A 2D projection of the aligned 3D mean-shape model is generated. The 2D projection includes a set of landmark points associated with the aligned 3D mean-shape model. The 2D projection is warped such that the set of landmark points in the 2D projection is aligned with a corresponding set of feature points in the color image. A 3D correspondence between the aligned 3D mean-shape model and the point cloud is determined for a non-rigid alignment of the aligned 3D mean-shape model, based on the warped 2D projection and the depth information.