US Patent 11558029 Acoustic wave device and communication apparatus
Patent 11558029 was granted and assigned to Kyocera Corporation on January, 2023 by the United States Patent and Trademark Office.
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Current Assignee
Patent Jurisdiction
Patent Number
115580290
Date of Patent
January 17, 2023
0Patent Application Number
166469130
Date Filed
September 11, 2018
0Patent Primary Examiner
Edits on 18 Jan, 2023
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US Patent 11558029 Acoustic wave device and communication apparatus
Article
A SAW device includes a mounting substrate including a mounting surface, a SAW chip mounted on the mounting surface, a dummy chip mounted on the mounting surface, and a resin part covering the acoustic wave chip and the dummy chip. The dummy chip includes an insulating dummy substrate, and one or more dummy terminals which are located on a surface of the dummy substrate on the mounting surface side and are bonded to the mounting surface. The dummy chip configures an open end when electrically viewed from the mounting substrate side.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
115580290
Date of Patent
January 17, 2023
0Patent Application Number
166469130
Date Filed
September 11, 2018
0Patent Primary Examiner
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