US Patent 11564312 Laser light source co-packaged with photonic integrated circuit and substrate

The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.