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US Patent 11569158 Semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 13, 2021
Date of Patent
January 31, 2023
Patent Application Number
17228784
Patent Citations
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US Patent 10475759 Integrated circuit structure having dies with connectors of different sizes
‌
US Patent 10510704 Package structure and method of manufacturing the same
‌
US Patent 10510710 Bump-on-trace interconnect
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US Patent 10515917 Bump on pad (BOP) bonding structure in semiconductor packaged device
‌
US Patent 10522438 Package structure having under ball release layer and manufacturing method thereof
‌
US Patent 10522488 Patterning polymer layer to reduce stress
‌
US Patent 10535609 Package structure and method for forming the same
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US Patent 10622336 Manufacturing method of semiconductor package
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US Patent 10602621 Method of manufacturing circuit board
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US Patent 11145611 Semiconductor package and method of manufacturing the same
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11569158
Patent Primary Examiner
‌
Nicholas J Tobergte
CPC Code
‌
H01L 23/3171
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H01L 23/49822
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H01L 23/49833
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H01L 23/49838
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H01L 23/5385
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H01L 23/5386
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H01L 24/16
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H01L 23/49816

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