US Patent 11569409 Transfer head assembly and LED transfer apparatus

Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.