US Patent 11574865 Method of forming semiconductor device including deep vias

A method (of manufacturing a semiconductor device) includes: forming via structures in a first via layer over a transistor layer; forming a first via structure of a first deep via arrangement in the first via layer; forming conductive segments in a first metallization layer over the first via layer; forming M_1st routing segments at least a majority of which, relative to a first direction, have corresponding long axes with lengths which at least equal if not exceed a first permissible minimum value for routing segments in the first metallization layer; forming an M_1st interconnection segment having a long axis which is less than the first permissible minimum value and which is included in the first deep via arrangement; and forming via structures in a second via layer over the first metallization layer, including forming a first via structure of the first deep via arrangement in the second via layer.