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US Patent 11577900 Packaging for microarrays

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11577900

Date of Patent

February 14, 2023

Patent Application Number

17420918

Date Filed

January 7, 2020

Patent Citations

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US Patent 10201691 Article comprising a microneedle

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US Patent 10561831 Transdermal administration device packaged body

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US Patent 10004567 Sterile packaging systems for medical devices

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US Patent 10315021 Collapsible patch and method of application

Patent Primary Examiner

CPC Code

A packaging system for microarrays, such as microarrays of microneedles, comprising inner and outer pouches (

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