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US Patent 11578925 Thermal management system for a test-and-measurement probe

Patent 11578925 was granted and assigned to Tektronix on February, 2023 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Tektronix
Tektronix
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Current Assignee
Tektronix
Tektronix
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
115789250
Date of Patent
February 14, 2023
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Patent Application Number
170966220
Date Filed
November 12, 2020
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Patent Citations
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US Patent 10034601 Heat resistant sheath for endoscope and endoscope system provided with heat resistant sheath for endoscope
Patent Primary Examiner
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Vinh P Nguyen
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CPC Code
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A61B 5/01
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A61B 2017/00199
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A61B 2017/00092
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A61B 2017/00119
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G01N 15/1404
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G01N 21/8507
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G01N 21/3563
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G01N 21/49
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A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

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