Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 14, 2023
Patent Application Number
16842083
Date Filed
April 7, 2020
Patent Citations
Patent Primary Examiner
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.
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