US Patent 11587845 Semiconductor structure
Patent 11587845 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2023 by the United States Patent and Trademark Office.
All edits
US Patent 11587845 Semiconductor structure
The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a die stack disposed over the substrate, a heat spreader disposed over the substrate and having a surface facing the substrate, and a thermal interface material (TIM) disposed between the die stack and the heat spreader. A bottommost die of the die stack includes a surface exposed from remaining dies of the die stack from a top view perspective; and the TIM is in contact with the exposed surface of the bottommost die and the surface of the heat spreader, and is in contact with a sidewall of at least one of the plurality of dies of the die stack.
Find more entities like US Patent 11587845 Semiconductor structure
