US Patent 11587899 Multi-layer semiconductor package with stacked passive components
Patent 11587899 was granted and assigned to Texas Instruments on February, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 29, 2020
0
Date of Patent
February 21, 2023
0
Patent Applicant
Patent Application Number
16941818
0
Patent Jurisdiction
Patent Number
CPC Code
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