Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 11587905 Multi-chip package and manufacturing method thereof
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
Date Filed
October 8, 2020
Date of Patent
February 21, 2023
Patent Application Number
17065527
Patent Citations
US Patent 10217720 Multi-chip modules formed using wafer-level processing of a reconstitute wafer
US Patent 11018080 Semiconductor package and method of forming the same
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11587905
Patent Primary Examiner
Bradley Smith
CPC Code
H01L 23/538
H01L 24/97
H01L 2224/97
H01L 23/481
Find more entities like US Patent 11587905 Multi-chip package and manufacturing method thereof
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE