US Patent 11589482 Cooling module with serial fluid management

Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.