Patent 11601575 was granted and assigned to GoPro on March, 2023 by the United States Patent and Trademark Office.
In one aspect of the present disclosure, a digital image capturing device (DICD) is disclosed that includes a device body with a printed circuit board (PCB), and an integrated sensor-lens assembly (ISLA) that is configured for releasable connection to the device body. The PCB defines a plurality of openings that extend therethrough and includes a plurality of connector pins that are fixedly positioned within the openings. The ISLA includes at least one connective surface that is configured for contact with the connector pins to establish electrical communication between the device body and the ISLA.