Patent 11606134 was granted and assigned to SPACE EXPLORATION TECHNOLOGIES CORP on March, 2023 by the United States Patent and Trademark Office.
In some embodiments, an apparatus includes a plurality of first conductive traces oriented in a first direction in a first layer and plurality of second conductive traces oriented in a second direction in a second layer coupled by vias to define first hierarchical networks. A plurality of third conductive traces oriented in the first direction in a third layer and a plurality of fourth conductive traces oriented in the second direction in a fourth layer are coupled by vias to define second hierarchical networks. Open ends of the first or second traces at a last stage of the first hierarchical networks comprise first ends and open ends of the third or fourth traces at a last stage of the second hierarchical networks comprise second ends. A first end and a corresponding second end are non-collinear to each other and perpendicular to a major plane of the first layer.