Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajesh Katkar0
Belgacem Haba0
Javier A. DeLaCruz0
Arkalgud Sitaram0
Date of Patent
March 21, 2023
0Patent Application Number
168449320
Date Filed
April 9, 2020
0Patent Citations
...
Patent Primary Examiner
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over the active circuitry and a second bonding layer on the obstructive material. The second bonding layer can be directly bonded to the first bonding layer without an adhesive. The obstructive material can be configured to obstruct external access to the active circuitry.
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