Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Gwang-Mun Choi0
Yong Sung Eom0
Kwang-Seong Choi0
Ki Seok Jang0
Jiho Joo0
Chanmi Lee0
Date of Patent
April 4, 2023
0Patent Application Number
173641280
Date Filed
June 30, 2021
0Patent Primary Examiner
CPC Code
Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
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