Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Steven M. Zuniga0
Andrew Nagengast0
Jay Gurusamy0
Date of Patent
April 11, 2023
0Patent Application Number
170879410
Date Filed
November 3, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.
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