Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chien Rhone Wang0
Y. Y. Peng0
Tzu-Cheng Lin0
Kewei Zuo0
Jerry Wang0
Date of Patent
April 11, 2023
0Patent Application Number
171789290
Date Filed
February 18, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.
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