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US Patent 11626362 Semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
May 28, 2021
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Date of Patent
April 11, 2023
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Patent Application Number
17333615
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Patent Citations
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US Patent 10410961 Fan-out semiconductor package
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US Patent 11205604 Semiconductor package including a thermal conductive layer and method of manufacturing the same
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US Patent 10340245 Fan-out semiconductor package module
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US Patent 11031328 Semiconductor package
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Patent Inventor Names
Junghyun Cho
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Youngsik Hur
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Youngkwan Lee
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Jongrok Kim
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11626362
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Patent Primary Examiner
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Victor A Mandala
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CPC Code
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H01L 23/49811
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H01L 2221/68345
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H01L 21/6836
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H01L 25/00
0
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H01L 23/3121
0
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H01L 24/45
0
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H01L 23/49861
0
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H01L 23/49827
0
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H01L 23/3128
0
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H01L 23/49894
0

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